Canteliver Probe Card
MPI Cantilever Probe Card is greatly utilized on gold bump and pad wafer screening for Screen driver, logic, and memory product. MPI’s cantilever probes would be the corresponding solution on the calls for of fine pitch, modest pad measurement, large speed, a lot less cleaning, multi-DUT, substantial pin count, and extremely-very low leakage needs. With excellent craftsmanship, modern architecture and confirmed methodologies based on mechanical and electrical simulation/measurement effects, producing MPI the best cantilever provider all over the world.
FCB Probe Card
The FCB Probe Card is considered the most experienced engineering of buckling beam probe card. It's aimed to realize the semiconductor ship manufacture time-to-sector (TTM) and cost of exam (COT) need. FCB is actually a proven Remedy for several different semiconductor manufacturing assessments from early engineering pilot-operates to high volume manufacturing (HVM). FCB is ready for system necessitating superior sign integrity probing (SI) and/or power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus more. FCB assures the whole world’s best In general cost-of-possession (COO) for a variety of DUT purposes.
EVS Probe Card
The EVS Probe Card is an improvement in excess of the traditional buckling beam probe card. Important characteristics are bigger present-day carrying ability (C.C.C.) and reduced well balanced Speak to force (BCF), as well as In general MEMS-like features. EVS can easily meet up with the requirement of Highly developed wafer probing. Precise alignment and fantastic planarity Management would be the critical aspects contributing to secure Make contact with resistance. With its ability and performance, EVS Probe Card is an ideal choice for State-of-the-art probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s Answer to need for at any time finer pitch. It truly is made for here scaled-down Al pad, and is particularly perfect for tiny pitch application with peripheral and complete array pattern. With precise alignment and much better planarity Handle, Osprey can get to better efficiency by multi-DUT structure. The forming wire (FW) type needle produced with MPI’s own micro fabrication system don't just provides superior-high-quality performance but will also will allow uncomplicated needle alternative and shortens preserving cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle which happens to be made for the demand of very low power probing. It also includes the ability to satisfy high C.C.C. and significant pin counts application. The MEMS course of action ensures remarkably constant needle features, as well as the Distinctive structure layout permits specific alignment and planarity Handle.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/